Applications

Bespoke Thermal Modules

Sunon has been synonymous with Laptop cooling solutions, incorporating Micro-blowers and Fans, for the past 20 years and as Laptops developed into notebooks and now netbooks, so has the need for even more stringent cooling requirements. With their Thermal Module development team based in Taipei, the computer technology centre of Taiwan, Sunon has developed a reputation for Thermal Solutions encompassing not only the benefits of forced air cooling, but also the combination of Heat Sinks, Vapour Chambers, Heat Pipes and Thermal Interface Materials. The experience and customer base gained over the past 10 years has led to Thermal Module design now being available to other markets where a complete ‘Thermal Solution’ is suited. Below you will discover examples of existing Solutions which are non-exhaustive and can be applied to any application:

  • Industrial PC

    • A combination of high power Cooling Fans, compact Extruded Heat Sinks and embedded Heat Pipes enable high speed processors to work within their specification due to effective cooling of their t-Case.
    • Industrial PC’s usually require very special customised thermal solutions, as they incorporate high power CPU/GPU’s within very limited space. In this case, three Heat Pipes are embedded inside the bottom Die Casting plate and a Copper plate is used to enhance the transfer of heat from the Chipset. This particular design is effective up to 115W.
     
  • LED Street Lighting

    • A number of LED street lighting manufacturers incorporate Extruded Heat Sinks to dissipate the heat of LED linear light modules. Unfortunately, with this solution, the overall weight is very heavy. The solution likes the attached file use Aluminium Stacked Fin with HP can have better thermal performance and with much lower weight.
    • A Stacked Heat Sink and Heat Pipe combination allows effective cooling of the LED light modules with a considerable reduction in weight. Heat Pipes allow heat to be transferred from the main source of heat to an area of cooler ambient temperature, where more efficient thermal transfer is made.
     
  • AIO PC

    • All In One PC’s are designed to offer a very compact product, with the monitor integrated into the system. A smaller form factor puts more pressure on thermal design than standard PC’s
    • The use of Heat Pipes, to transfer heat away from the main processor and graphics chip set to a suitable position for exhausting through a Fan assisted Stacked Heat Sink.
     
  • Digital Projector

    • Intense heat, generated by high output metal halide lamps, requires a combination of a small Extruded Heat Sink to draw the heat from the lamp body, Heat Pipes to transfer the heat to a larger Stacked Heat Sink, which itself will have the heat removed by Cooling Fans.
    • As with many light source products, Projector manufacturers are now converting to LED’s. As a result, they will face the thermal issue of R/G/B and DMD Chips. Sunon has vast experience in both large projectors, for use in movie theatres and smaller products used in meeting rooms etc. One to three Heat Pipes are required in the R/G/B solution.
     
  • Server/Telecoms

    • Stacked fin Heat Sinks offer high thermal performance when combined with Cooling Fans or blowers, due to increased surface area of the fins which equates to higher thermal dissipation properties.
    • Server chipsets are usually very high powered, but are required to be installed within a 1U to 2U space limitation. 1U is 44.5mm, so when you consider the Server Case thickness and PCB/Chip height, you are left with a height envelope, for the thermal solution, of only 22-24 mm. Despite this, the Server CPU thermal power is usually more than 110-130W.
    • For extreme Server applications, Heat Pipes and Vacuum Chambers are needed and on occasions the Stacked Fin material will change from Aluminium to Copper to increase heat dissipation efficiency.
     
  • Set Top Box

    • A combination of low speed Cooling Fan and Extruded, low profile Heat Sink, gives effective cooling within an application where low power dissipation is required along with low noise at a cost effective price.
    • As the Set Top Box industry very price sensitive, most solutions use Extruded Head Sinks alone. Even where thermal power is too high for Heat Sinks alone, more and more Set Top Box manufacturers are considering ‘Fanless’ solutions.
    • Sunon has the capability to provide a Fanless solution, however, this may not be cheaper, if the original design incorporates a Fan, as the increase in Heat Sink material cost and size can be prohibitive. The major design consideration of the Fanless solution is how to use the system case as the heat dissipation surface.
     
 

Please contact us to arrange a visit from one of our application engineers or to request a competitive quotation.